Business
TSMC Plans New Kaohsiung Hub as AI Chip Boom Sends Advanced Packaging Demand Soaring
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding its advanced-packaging footprint in Kaohsiung, planning a new facility at Baipu Industrial Park as artificial intelligence drives unprecedented demand for high-performance chips. The company plans to develop a 3-hectare site featuring two flexible buildings, small cleanrooms and laboratories for advanced-packaging testing, joint development and process research, TSMC Vice President of Advanced Packaging Technology and Service Jun He sai
